IoT

Power Inductor/Molding

BDCD

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

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BMRA

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

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BMRB

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

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BMRF

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

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BMRG

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

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MHCI

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

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MHCC

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

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MHCD

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

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Power Inductor/Wire-Wound

BWVC

Closed Magnetic Circuit Type - Automatic Assembly

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BWVF

Closed Magnetic Circuit Type - Automatic Assembly

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BWVH

Closed Magnetic Circuit Type - Automatic Assembly

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BWVS

Closed Magnetic Circuit Type - Automatic Assembly

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BWVT

Closed Magnetic Circuit Type - Automatic Assembly

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BPSD

Ferrite SMD Unshielded Type

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LVC

Closed Magnetic Circuit Type - Automatic Assembly

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LVF

Closed Magnetic Circuit Type - Automatic Assembly

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LVH

Closed Magnetic Circuit Type - Automatic Assembly

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LVS

Closed Magnetic Circuit Type - Automatic Assembly

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LVT

Closed Magnetic Circuit Type - Automatic Assembly

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SCD

Ferrite SMD Unshielded Type

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RF Inductor/Multilayer

CL

Multilayer-STD

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RF Inductor/Wire-Wound

BWCS

Wire Wound-STD

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BWNC

Wire Wound-High Current

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BWNL

Wire Wound-STD

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CS

Wire Wound-STD

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NLC

Wire Wound-High Current

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NL

Wire Wound-STD

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Antenna

BTPA

PCB Antenna

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EMI/Bead

BBSY

For General Signal Line Under 1GHz

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BBBK

For General Signal Line Under 1GHz

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BBPY

For Power Line Under 1 GHz

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BBUP

For Ultra High Current Use Under 1 GHz

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SBY

For General Signal Line Under 1GHz

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SBK

For General Signal Line Under 1GHz

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PBY

For Power Line Under 1 GHz

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UPB

For Ultra High Current Use Under 1 GHz

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EMI/CMC

BWCU

02_For USB 2.0,IEEE1394,LVDS HDMI1.4
03_For USB 3.1,HDMI 2.0, IEEE1394b,LVDS

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