5G

Power Inductor/Multilayer

BKPA

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line

BKPB

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line Low DC Resistance

BKPE

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line Low DC Resistance & Higher Saturation Current

Power Inductor/Molding

BMQE

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRA

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRB

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRF

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRG

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

Power Inductor/Wire-Wound

BWVC

Closed Magnetic Circuit Type - Automatic Assembly

BWVF

Closed Magnetic Circuit Type - Automatic Assembly

BWVH

Closed Magnetic Circuit Type - Automatic Assembly

BWVS

Closed Magnetic Circuit Type - Automatic Assembly

BWVT

Closed Magnetic Circuit Type - Automatic Assembly

BMQE

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRA

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRB

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRF

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRG

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

RF Inductor/Multilayer

BSCQ

Multilayer-STD

RF Inductor/Wire-Wound

BWCS

Wire Wound-STD

BWLS

Wire Wound-STD

EMI/Bead

BBPY

For Power Line Under 1 GHz