物联网应用

Power Inductor/Multilayer

BKPA

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line

BKPB

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line Low DC Resistance

BKPE

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line Low DC Resistance & Higher Saturation Current

MPA

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line

MPB

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line Low DC Resistance

MPE

Closed Magnetic Circuit Type Multilayer Processing Inductor for Power line Low DC Resistance & Higher Saturation Current

Power Inductor/Molding

BDCD

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

MHCD

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

Power Inductor/Wire-Wound

BWMR

Closed Magnetic Circuit Type - Automatic Assembly

BWVF

Closed Magnetic Circuit Type - Automatic Assembly

BWVH

Closed Magnetic Circuit Type - Automatic Assembly

LVF

Closed Magnetic Circuit Type - Automatic Assembly

LVH

Closed Magnetic Circuit Type - Automatic Assembly

MRSC

Closed Magnetic Circuit Type - Automatic Assembly

RF Inductor/Multilayer

BSCQ

Multilayer-STD

BSPQ

Film

CHQ

Multilayer-STD

CL

Multilayer-STD

RF Inductor/Wire-Wound

BWCM

Wire Wound-STD

BWCS

Wire Wound-STD

CM

Wire Wound-STD

CS

Wire Wound-STD

Antenna

BTCA

Multilayer Antenna-STD

EMI/Bead

BBSJ

For High Speed Signal Line Under 1GHz

BBSY

For General Signal Line Under 1GHz

BBBK

For General Signal Line Under 1GHz

BBNQ

For High Speed Signal Line Under 1GHz

BBFJ

For GHz Band General Use

SBJ

For High Speed Signal Line Under 1GHz

SBY

For General Signal Line Under 1GHz

SBK

For General Signal Line Under 1GHz

NBQ

For High Speed Signal Line Under 1GHz

HFJ

For GHz Band General Use

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