物联网应用

Power Inductor/Molding

BDCD

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRA

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRB

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRF

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

BMRG

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

MHCI

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

MHCC

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

MHCD

Closed Magnetic Circuit Type Molding Processing & for Ultra High Current

Power Inductor/Wire-Wound

BWVC

Closed Magnetic Circuit Type - Automatic Assembly

BWVF

Closed Magnetic Circuit Type - Automatic Assembly

BWVH

Closed Magnetic Circuit Type - Automatic Assembly

BWVS

Closed Magnetic Circuit Type - Automatic Assembly

BWVT

Closed Magnetic Circuit Type - Automatic Assembly

BPSD

Ferrite SMD Unshielded Type

LVC

Closed Magnetic Circuit Type - Automatic Assembly

LVF

Closed Magnetic Circuit Type - Automatic Assembly

LVH

Closed Magnetic Circuit Type - Automatic Assembly

LVS

Closed Magnetic Circuit Type - Automatic Assembly

LVT

Closed Magnetic Circuit Type - Automatic Assembly

SCD

Ferrite SMD Unshielded Type

RF Inductor/Multilayer

CL

Multilayer-STD

RF Inductor/Wire-Wound

BWCS

Wire Wound-STD

BWNC

Wire Wound-High Current

BWNL

Wire Wound-STD

CS

Wire Wound-STD

NLC

Wire Wound-High Current

NL

Wire Wound-STD

Antenna

BTPA

PCB Antenna

EMI/Bead

BBSY

For General Signal Line Under 1GHz

BBBK

For General Signal Line Under 1GHz

BBPY

For Power Line Under 1 GHz

BBUP

For Ultra High Current Use Under 1 GHz

SBY

For General Signal Line Under 1GHz

SBK

For General Signal Line Under 1GHz

PBY

For Power Line Under 1 GHz

UPB

For Ultra High Current Use Under 1 GHz

EMI/CMC

BWCU

02_For USB 2.0,IEEE1394,LVDS HDMI1.4
03_For USB 3.1,HDMI 2.0, IEEE1394b,LVDS